july 2011 doc id 018984 rev 1 1/8 8 EMIF06-MSD03F3 6-line low capacitance ipad? for micro-sd card with emi filtering and esd protection features emi low-pass filter esd protection 15 kv (iec 61000-4-2) integrated pull up resistors to prevent bus floating when no card is connected 208 mhz clock frequency compatible with sdr104 mode (sd3.0) lead-free package coated version option on request electrical card detect option benefits low power consumption easy layout thanks to smart pin-out configuration very low pcb space consumption high reliability offered by monolithic integration reduction of parasitic elements thanks to csp integration complies with the following standards: iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) application micro (t-flash) secure di gital memory card in: mobile phones communication systems description the EMIF06-MSD03F3 is a highly integrated device based on ipad technology offering two functions: esd protection to comply with iec standard, and emi filtering to reject mobile phone frequencies. figure 1. pin configuration (bump side) tm : ipad is a trademark of stmicroelectronics flip chip (16 bumps) 1 2 3 4 d c b a www.st.com
characteristics EMIF06-MSD03F3 2/8 doc id 018984 rev 1 1 characteristics figure 2. EMIF06-MSD03F3 configuration table 1. absolute ratings (limiting values) symbol parameter value unit v pp esd discharge iec 61000-4-2, level 4 air discharge, card side contact discharge, card side air discharge, ic side contact discharge, icside 15 8 2 2 kv t j maximum junction temperature 125 c t op operating temperature range - 40 to + 85 c t stg storage temperature range - 55 to + 150 c table 2. pin configuration pin signal pin signal a1 data0 c1 cmd a2 data1 c2 v cc2 a3 sddata1 c3 v ss a4 sddata0 c4 sdcmd b1 clk d1 data3/cd b2 v cc1 d2 data2 b3 v ss d3 sddata2 b4 sdclk d4 sddata3/cd gnd vcc1 clk cmd data 0 data 1 data 2 data 3/cd sdclk sdcmd sddata 0 sddata 1 sddata 2 sddata 3/cd vcc2 15kv r1 r2 r3 r4 r5 r6 2kv r9 r10 r11 r12 r13
EMIF06-MSD03F3 characteristics doc id 018984 rev 1 3/8 table 3. electrical characteristic symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 14 16 v i rm leakage current at v rm v rm = 3 v 0.1 a r1, r2, r3, r4, r5, r6 serial resistance tolerance 10 %, matching 2 % 40 r9, r10, r11, r12 pull-up resistance tolerance 10 %, matching 2 % 50 k r13 pull-up resistance on cmd tolerance 10 % 15 k c line data line capacitance v = 0 v, f = 10 mhz, v osc = 30 mv 10 12 pf v = 1.8 v, f = 10 mhz, v osc = 30 mv 7.5 10 v = 2.9 v, f = 10 mhz, v osc = 30 mv 9 f 0 cut-off frequency s21 = -3 db 550 mhz t r ,t f rise and fall time c load = 10 pf, low-ref = 0.58 v, high-ref = 1.27 v, v ddio = 1.8 v 0.98 ns figure 3. s21 attenuation measurements figure 4. analog crosstalk measurements 100.0k 1.0m 10.0m 100.0m 1.0g -30.00 -25.00 -20.00 -15.00 -10.00 -5.00 0.00 clk data0 data1 data2 data3 cmd f (hz) s21 (db) db 100.0k 1.0m 10.0m 100.0m 1.0g -120.00 -110.00 -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 clk-data0 data3-sddata0 f (hz) figure 5. line capacitance versus applied voltage (typical values) figure 6. line capacitance versus frequency (typical values) c (pf) 0 1 2 3 4 5 6 7 8 9 10 11 12 012345 f=10 mhz v osc =30 mv t amb =25 c clk data0 cmd data3 v bias (v) 0.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 0 50 100 150 200 250 300 350 f=1mhz to 350mhz v osc =30mv rms t j =25 c line data/gnd a3/b3 (sddata1) & d3/c3 (sddata2) f (mhz) c (pf)
characteristics EMIF06-MSD03F3 4/8 doc id 018984 rev 1 figure 7. digital crosstalk measurements v cc = 3.9 v figure 8. esd response to iec 61000-4-2 (+8 kv contact discharge) on one input and one output figure 9. esd response to iec 61000-4-2 (-8 kv contact discharge) on one input and one output 20.0 v/div 10.0 v/div 20 ns/div 20 ns/div 10.0 v/div 10.0 v/div 20 ns/div 20 ns/div
EMIF06-MSD03F3 ordering information scheme doc id 018984 rev 1 5/8 2 ordering information scheme figure 10. ordering information scheme emif 06 - msd 03 f3 emi filter number of lines application msd = micro sd card version 03 = 10 pf line capacitance package f = flip chip 3= lead-free, pitch = 400 m, bump = 255 m
package information EMIF06-MSD03F3 6/8 doc id 018984 rev 1 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. package dimensions figure 12. footprint figure 13. marking 1.54 mm 40 m 1.54 mm 40 m 255 m 40 400 m 40 400 m 40 170 m 10 170 m 10 605 m 55 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y z w x w dot, st logo ecopack status xx = marking yww = datecode y = year, ww = week z = manufacturing location
EMIF06-MSD03F3 ordering information doc id 018984 rev 1 7/8 figure 14. tape and reel specification 4 ordering information note: more information is availa ble in the application notes: an2348: ?flip chip: package description and recommendations for use? an1751: "emi filters: recommendations and measurements" 5 revision history dot identifying pin a1 location user direction of unreeling all dimensionsare typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.69 1.68 0.20 st st st xxz yww xxz yww xxz yww e e e 1.68 st st st xxz yww xxz yww xxz yww e e e table 4. ordering information order code marking package weight base qty delivery mode EMIF06-MSD03F3 jv flip chip 3.2 mg 5000 tape and reel 7? table 5. document revision history date revision changes 11-jul-2011 1 first issue.
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